In general, a tin furnace refers to a welding tool used in electronic soldering. For discrete component circuit boards, the welding consistency is good, the operation is convenient, fast, and the work efficiency is high. It is a good helper for your production and processing.
How to use a tin stove
When using the machine for the first time, turn on the power switch and the PID meter will light up. You should first set the PID to 250°C for the electric heating tube to start heating; at the same time, move the tin bar back and forth on the electric heating tube evenly. In the tin bath, it is better to keep the height of molten tin at about 80[%]-90[%] of the depth of the tin bath, and do not put the tin bar directly on the heating tube by mistake, otherwise the heating tube will be burned if the temperature is too high; After the amount of molten tin covers the electric heating tube, the tin bar can be directly put into the tin tank for automatic tin (it is recommended to use tin bar with a tin content of 63[%], the temperature is preferably set at 220°C-250°C, and the tin content is 60[% ] tin bars, the temperature is preferably set at 250°C-280°C, for reference only)
Note: When melting tin for the first time, remember to move the tin bar evenly back and forth on the electric heating tube until the amount of tin melting covers the electric heating tube, then put the tin bar directly to melt tin, otherwise, the electric heating tube will burn out if the temperature is too high.
When the tin temperature rises to the set temperature, wait for the temperature to fall back slightly, use a scraper to scrape off the residual oxide on the surface after melting the tin, and then clamp the circuit board with the inserted components with a special substrate clip, and spray it to see if there is any failure .
Short circuit: Excessive solder joints cause more than two solder joints to connect.
The time for the PCB board to eat tin is not enough, and the preheating is not enough, just adjust the set temperature.
Poor flux: the proportion of flux is not deteriorated, etc.
The direction of the substrate is poorly matched with the tin wave, and the direction of the tin is changed.
Poor design of the PCB board circuit: the wire furnace or solder joints are too close (should have a spacing of more than 0.6mm); if it is an array solder joint or IC, it should be separated by stealing tin pads or using white paint. The thickness of the white paint needs to be more than twice the thickness of the solder pad (golden road).
Contaminated tin or accumulated peroxides are carried by PUMP to cause a short circuit. The tin furnace should be cleaned or the solder in the tin tank should be completely renewed.
